Encapsulation Technologies for Electronic ...

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Sprache: Englisch

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Beschreibung

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages.

In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology.

Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic.

In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology.

Inhaltsverzeichnis

1. Introduction2. Plastic Encapsulant Materials3. Encapsulation Process Technology4. Characterization of Encapsulant Properties5. Encapsulation Defects and Failures6. Defect and Failure Analysis Techniques for Encapsulated Microelectronics7. Qualification and Quality Assurance8. Trends and Challenges

Erscheinungsjahr:	2018
Medium:	Taschenbuch
Inhalt:	Kartoniert / Broschiert
ISBN-13:	9780128119785
ISBN-10:	0128119780
Sprache:	Englisch
Herstellernummer:	C2016-0-01829-6
Autor:	Ardebili, Haleh Zhang, Jiawei Pecht, Michael G.
Redaktion:	Licari, James J.
Auflage:	2. Aufl.
Hersteller:	William Andrew
Verantwortliche Person für die EU:	preigu, Ansas Meyer, Lengericher Landstr. 19, D-49078 Osnabrück, mail@preigu.de
Maße:	23 x 152 x 229 mm
Von/Mit:	Haleh Ardebili (u. a.)
Erscheinungsdatum:	11.10.2018
Gewicht:	0,818 kg

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