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Beschreibung
Microchannel Heat transfer is the cooling application of high power density microchips in the CPU system, micropower systems and many other large scale thermal systems requiring effective cooling capacity.
This book offers the latest research and recommended models on the microsize cooling system which not only significantly reduces the weight load, but also enhances the capability to remove much greater amount of heat than any of large scale cooling systems.

A detailed reference in microchannel phase change (boiling and condensation) including recommended models and correlations for various requirements such as pressure loss, and heat transfer coefficient.

Researchers, engineers, designers and students will benefit from the collated, state-of-the-art of the research put together in this book and its systematic, addressing all the relevant issues and providing a good reference for solving problems of critical analysis.

Microchannel Heat transfer is the cooling application of high power density microchips in the CPU system, micropower systems and many other large scale thermal systems requiring effective cooling capacity.
This book offers the latest research and recommended models on the microsize cooling system which not only significantly reduces the weight load, but also enhances the capability to remove much greater amount of heat than any of large scale cooling systems.

A detailed reference in microchannel phase change (boiling and condensation) including recommended models and correlations for various requirements such as pressure loss, and heat transfer coefficient.

Researchers, engineers, designers and students will benefit from the collated, state-of-the-art of the research put together in this book and its systematic, addressing all the relevant issues and providing a good reference for solving problems of critical analysis.

Inhaltsverzeichnis
Introduction

Scale differentiation

Flow pattern with bubble growth

Heat transfer with models

Pressure drop

Instabilities

Onset of nucleate boiling

Void fraction

Liquid film thickness

Critical heat flux

Condensation and boiling enhancement

Convective condensation

Predictive methods

Conclusion

Details
Erscheinungsjahr: 2015
Medium: Taschenbuch
Inhalt: Kartoniert / Broschiert
ISBN-13: 9780128043189
ISBN-10: 0128043180
Sprache: Englisch
Herstellernummer: C2014-0-04349-3
Autor: Saha, Sujoy Kumar
Hersteller: Butterworth-Heinemann
Elsevier Science & Technology
Verantwortliche Person für die EU: Zeitfracht Medien GmbH, Ferdinand-Jühlke-Str. 7, D-99095 Erfurt, produktsicherheit@zeitfracht.de
Maße: 17 x 152 x 229 mm
Von/Mit: Sujoy Kumar Saha
Erscheinungsdatum: 28.09.2015
Gewicht: 0,54 kg
Artikel-ID: 126702774

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